factory tour >> process &testing capabilities >> process capabilities
• from 01005 chip to maximum 74mmx74mm body size packages/modules
• maximum pcb size 610mm x560mm
• plastic / ceramic bga / lga packages
• ultra-fine 0.3mm pitch component placement capability
• placement accuracy 18 micron
• bga rework and inspection capability
• rigid board & flexible printed circuit (fpc) assembly capability
• class 10k & 100k class clean-room manufacturing for chip on board (cob) assembly.
• advance manufacturing process for special pcb assembly (metal back)
• conformal coating
• epoxy encapsulation
• clean / no –clean process.
• pcb finishes: hasl, immersion tin/ gold/ silver, osp
• ipc610 class ii & iii acceptance standard.
• assembly in accordance iso13485, iso/ts 16949 requirement.